top view side view (section aa) 30.23mm [1.190"] 25.48mm [1.003"] a a 34.5mm + ic thickness a l l t o l e r a n c e s : 0.125mm (unless stated otherwise). materials and specifications are subject to change without notice. 1 2 3 page 1 of 4 features directly mounts to target pcb (needs tool ing holes) with hardware minimum real estate required compression plate distributes forces even ly clamshell lid compression plate: black anodized aluminum. thickness = 8.5 mm. compression screw: clear anodized aluminum. height = 25 mm, fluted knob socket base: black anodized aluminum. height = 6 mm. clam shell lid: black anodized aluminum. height = 16.5 mm. socket base screw: socket head cap screw, alloy steel with black oxide finish, 0-80 thread, 5/8" long. backing plate: black anodized aluminum. thickness= 4mm insulation plate: fr4/g10 1 m a t e r i a l s : 2 3 4 5 6 7 8 9 customer's bga ic 4 8 9 7 10 11 13 6 5 11 10 customer's pcb ic guide: ultem ball guide: kapton polyimide. elastomer guide: non-clad fr4. thickness = 0.475mm. 12 12 elastomer: 20 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). thickness = 0.5mm. 13 latch: black anodised aluminum. status: released drawing: vinayak r rev: a date: 2/16/10 modified: file: CG-BGA-5003 dwg CG-BGA-5003 drawing ? 2010 ironwood electronics, inc. tele: (952) 229-8200 www.ironwoodelectronics.com scale: 1.33:1
socket body size non plated mounting hole non plated alignment hole orientation mark 1.25mm 0.13mm (x4) 1.25mm 0.13mm (x4) 5.080mm 15.225mm 0.125mm (x4) 12.725mm (x4) 2.540mm 4.1125mm 5.50mm *3.8625mm 0.50mm typ. ? 0.850mm 0.025mm (x2) 4.50mm 17.73mm sqr. backing plate outline ? 1.75mm 0.05mm (x4) ? 0.25mm pad (x120) soclet lid size page 2 of 4 recommended pcb layout tolerances: 0.025mm [0.001] unless stated otherwise. r e c o m m e n d e d p c b l a y o u t t o p v i e w * n o t e : b g a p a t t e r n i s n o t s y m m e t r i c a l w i t h r e s p e c t t o t h e m o u n t i n g h o l e s . t a r g e t p c b r e c o m m e n d a t i o n s total thickness: 1.6mm min. plating: gold or solder finish pcb pad height: same or higher than solder mask recommended pcb layout tolerances: 0.025mm [0.00 1] unless stated otherwise. all dimensions are in mm unless stated otherwise status: released drawing: vinayak r rev: a date: 2/16/10 modified: file: CG-BGA-5003 dwg CG-BGA-5003 drawing ? 2010 ironwood electronics, inc. tele: (952) 229-8200 www.ironwoodelectronics.com scale: 4:1
bottom view c o m p a t i b l e b g a s p e c z a1 0.08 z 0.10 z y 5 4 ? b 3 top view front view e d e x 3 4 5 dimensions are in millimeters. interpret dimensions and tolerances per asme y14.5m-1994. dimension b is measured at the maximum solder ball diameter, parallel to datum plane z. datum z (seating plane) is defined by the spherical crowns of the solder balls. parallelism measurement shall exclude any effect of mark on top surface of package. 1. 2. 10 x 12 array dim min max a 3.00 a1 0.25 b 0.30 d e e 0.5 bsc 0.225 6.0 bsc 7.0 bsc a ?0.15 ?0.08 x y page 3 of 4 status: released drawing: vinayak r rev: a date: 2/16/10 modified: file: CG-BGA-5003 dwg CG-BGA-5003 drawing ? 2010 ironwood electronics, inc. tele: (952) 229-8200 www.ironwoodelectronics.com scale: 8:1
side view top view description: b a c k i n g p l a t e w i t h i n s u l a t i o n p l a t e 17.73mm 2.50mm 2.50mm 12.725mm 0.025mm (x4) 4.00mm sqr. 7.94mm 2.00mm 4.00mm ? 1.61mm 0.05mm (x4) 1.27mm (x4) 1.59mm 4.00mm insulation plate backing plate 17.73mm all dimensions are in mm. all tolerences are +/- 0.125mm. (unless stated otherwise) page 4 of 4 status: released drawing: vinayak r rev: a date: 2/16/10 modified: file: CG-BGA-5003 dwg CG-BGA-5003 drawing ? 2010 ironwood electronics, inc. tele: (952) 229-8200 www.ironwoodelectronics.com scale: 4:1
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